The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.160 INCHES MAXIMUM IN, body_length: 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND LOW POWER, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-605-0692, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |
| body_height | 0.160 INCHES MAXIMUM IN |
| body_length | 0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND LOW POWER |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | QUAD 2 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 14 PRINTED CIRCUIT |
| NSN | 5962-00-605-0692 |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND LOW POWER |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND |
| TERMINAL SURFACE TREATMENT | SOLDER |
| TERMINAL TYPE AND QUANTITY | 14 PRINTED CIRCUIT |
| INCLOSURE MATERIAL | CERAMIC |
| BODY HEIGHT | 0.160 INCHES MAXIMUM IN |
| BODY WIDTH | 0.240 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN |