54H71FM: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN, body_length: 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH SPEED AND PRESETTABLE AND W/ENABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, precious_material: GOLD. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-054-8027, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN |
| body_length | 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH SPEED AND PRESETTABLE AND W/ENABLE |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| precious_material | GOLD |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | FLAT PACK |
| NSN | 5962-01-054-8027 |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | GOLD |
| PRECIOUS MATERIAL | GOLD |
| DESIGN FUNCTION AND QUANTITY | 1 FLIP-FLOP, J-K, AND/OR INPUT AND 1 FLIP-FLOP, J-K, CLOCKED AND 1 FLIP-FLOP, J-K, MASTER SLAVE |
| BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH SPEED AND PRESETTABLE AND W/ENABLE |
| INCLOSURE CONFIGURATION | FLAT PACK |
| CASE OUTLINE SOURCE AND DESIGNATOR | T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |