54F244/B2A — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

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PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND 3-STATE OUTPUT AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-287-3371, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

54F244/B2A

NSN: 5962-01-287-3371
FSC: 5962
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)

SPECIFICATIONS

body_width	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height	0.064 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND 3-STATE OUTPUT AND SCHOTTKY
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	LEADLESS FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	20 LEADLESS
NSN	5962-01-287-3371

COMPONENT DIAGRAM

KEY FEATURES

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TIME RATING PER CHACTERISTIC: 6.50 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 7.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

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SPECIFICATION/STANDARD DATA: 81349-MIL-M-38510/332 GOVERNMENT SPECIFICATION

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TERMINAL SURFACE TREATMENT: SOLDER

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DESIGN FUNCTION AND QUANTITY: 8 BUFFER, NONINVERTING

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INCLOSURE MATERIAL: CERAMIC

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OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

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INCLOSURE CONFIGURATION: LEADLESS FLAT PACK

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

TECHNICAL CHARACTERISTICS (FLIS)

TIME RATING PER CHACTERISTIC	6.50 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 7.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
SPECIFICATION/STANDARD DATA	81349-MIL-M-38510/332 GOVERNMENT SPECIFICATION
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	8 BUFFER, NONINVERTING
INCLOSURE MATERIAL	CERAMIC
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
BODY LENGTH	0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN

VERIFIED SUBSTITUTES & CROSS-REFERENCES 39

513121-1Interchangeable