54ACT374FMQB — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

54ACT374FMQB: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.540 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-336-5573, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

54ACT374FMQB

NSN: 5962-01-336-5573
FSC: 5962 — Microcircuits, Electronic
CAGE: 27014 — NATIONAL SEMICONDUCTOR CORPORATION (USA)

SPECIFICATIONS

body_width	0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height	0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.540 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
NSN	5962-01-336-5573

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 8 FLIP-FLOP, D-TYPE

•

BODY WIDTH: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	8 FLIP-FLOP, D-TYPE
BODY WIDTH	0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	FLAT PACK
CASE OUTLINE SOURCE AND DESIGNATOR	F-9 MIL-M-38510
BODY LENGTH	0.540 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 4

5962-8763101SXReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8763101SBReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-87631Reference document

Same NSN cross-reference

Reference document — Identification reference

5962-8763101SASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is 54ACT374FMQB?

54ACT374FMQB is a MICROCIRCUIT,DIGITAL.

What parts can replace 54ACT374FMQB?

There are 4 known substitutes for 54ACT374FMQB: 5962-8763101SX, 5962-8763101SB, 5962-87631 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 54ACT374FMQB?

54ACT374FMQB is cataloged in the U.S. Government catalog under NSN 5962-01-336-5573. This indicates validated use in U.S. government and defense supply chains.

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