The SEMICONDUCTOR DEVICE SET is a the manufacturer industrial component. Key specifications include material: COPPER ALLOY OVERALL, surface_treatment: OXIDE FILM OVERALL, post_base_diameter: 0.365 INCHES MINIMUM AND 0.375 INCHES MAXIMUM IN, post_head_diameter: 0.148 INCHES MINIMUM AND 0.152 INCHES MAXIMUM IN, post_overall_length: 0.315 INCHES MINIMUM AND 0.325 INCHES MAXIMUM IN, snap_fastener_post_style: POST. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5325-00-641-1030, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | COPPER ALLOY OVERALL |
| surface_treatment | OXIDE FILM OVERALL |
| post_base_diameter | 0.365 INCHES MINIMUM AND 0.375 INCHES MAXIMUM IN |
| post_head_diameter | 0.148 INCHES MINIMUM AND 0.152 INCHES MAXIMUM IN |
| post_overall_length | 0.315 INCHES MINIMUM AND 0.325 INCHES MAXIMUM IN |
| snap_fastener_post_style | POST |
| component_name_and_quantity | 2 SEMICONDUCTOR DEVICE DIODE |
| component_function_relationship | UNMATCHED |
| general_characteristics_item_description | 3 HOLES 0.189 IN. DIA; 3.887 IN. DIA; 0.876 IN. THK IN |
| NSN | 5325-00-641-1030 |
| SNAP FASTENER POST STYLE | POST |
| MATERIAL | COPPER ALLOY OVERALL |
| SURFACE TREATMENT | OXIDE FILM OVERALL |
| POST HEAD DIAMETER | 0.148 INCHES MINIMUM AND 0.152 INCHES MAXIMUM IN |
| POST BASE DIAMETER | 0.365 INCHES MINIMUM AND 0.375 INCHES MAXIMUM IN |
| POST OVERALL LENGTH | 0.315 INCHES MINIMUM AND 0.325 INCHES MAXIMUM IN |