54504-80101 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

54504-80101: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.562 INCHES MAXIMUM IN, body_height: 0.187 INCHES MAXIMUM IN, body_length: 1.625 INCHES MAXIMUM IN, features_provided: PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-374-0079, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

54504-80101

NSN: 5962-01-374-0079
FSC: 5962 — Microcircuits, Electronic
CAGE: 7ZXR5 — KEYSIGHT TECHNOLOGIES INC (USA)

SPECIFICATIONS

body_width	0.562 INCHES MAXIMUM IN
body_height	0.187 INCHES MAXIMUM IN
body_length	1.625 INCHES MAXIMUM IN
features_provided	PROGRAMMED
inclosure_material	CERAMIC
memory_device_type	PROM
test_data_document	96906-DOD-STD-100 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	6625013041743 E/I FSCM 03950
inclosure_configuration	DUAL-IN-LINE
specification/standard_data	28480-54504-80101 MANUFACTURERS SOURCE CONTROL
time_rating_per_chacteristic	200.00 NANOSECONDS NOMINAL ACCESS NS
NSN	5962-01-374-0079

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

BODY WIDTH: 0.562 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.187 INCHES MAXIMUM IN

•

FEATURES PROVIDED: PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PROM

•

SPECIFICATION/STANDARD DATA: 28480-54504-80101 MANUFACTURERS SOURCE CONTROL

•

BODY LENGTH: 1.625 INCHES MAXIMUM IN

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
BODY WIDTH	0.562 INCHES MAXIMUM IN
BODY HEIGHT	0.187 INCHES MAXIMUM IN
FEATURES PROVIDED	PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PROM
SPECIFICATION/STANDARD DATA	28480-54504-80101 MANUFACTURERS SOURCE CONTROL
BODY LENGTH	1.625 INCHES MAXIMUM IN
OPERATING TEMP RANGE	-55.0 TO 125.0 CELSIUS DEGC
PART NAME ASSIGNED BY CONTROLLING AGENCY	MICROCIRCUIT DIGITAL,PROM

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 1

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 54504-80101?

54504-80101 is a MICROCIRCUIT,MEMORY.

What parts can replace 54504-80101?

There is 1 known substitute for 54504-80101: ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 54504-80101?

54504-80101 is cataloged in the U.S. Government catalog under NSN 5962-01-374-0079. This indicates validated use in U.S. government and defense supply chains.

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54504-80101 — MICROCIRCUIT,MEMORY

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