53S280J/883 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

53S280J/883: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.263 INCHES MINIMUM AND 0.307 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.937 INCHES MINIMUM AND 0.987 INCHES MAXIMUM IN, features_provided: PROGRAMMED AND SCHOTTKY AND W/OPEN COLLECTOR AND HIGH PERFORMANCE AND BIPOLAR AND W/ENABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-374-5602, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

53S280J/883

NSN: 5962-01-374-5602
FSC: 5962 — Microcircuits, Electronic
CAGE: 34335 — ADVANCED MICRO DEVICES INC DBA AMD AUSTIN (USA)

SPECIFICATIONS

body_width	0.263 INCHES MINIMUM AND 0.307 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	0.937 INCHES MINIMUM AND 0.987 INCHES MAXIMUM IN
features_provided	PROGRAMMED AND SCHOTTKY AND W/OPEN COLLECTOR AND HIGH PERFORMANCE AND BIPOLAR AND W/ENABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-374-5602

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.263 INCHES MINIMUM AND 0.307 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: PROGRAMMED AND SCHOTTKY AND W/OPEN COLLECTOR AND HIGH PERFORMANCE AND BIPOLAR AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

CURRENT RATING PER CHARACTERISTIC: 185.00 MILLIAMPERES MAXIMUM SUPPLY

•

MEMORY DEVICE TYPE: PROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.263 INCHES MINIMUM AND 0.307 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	PROGRAMMED AND SCHOTTKY AND W/OPEN COLLECTOR AND HIGH PERFORMANCE AND BIPOLAR AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	185.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPE	PROM
BODY LENGTH	0.937 INCHES MINIMUM AND 0.987 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

995-9500-067Reference document

Same NSN cross-reference

Reference document — Secondary reference

351-1933-012Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 53S280J/883?

53S280J/883 is a MICROCIRCUIT,MEMORY.

What parts can replace 53S280J/883?

There are 3 known substitutes for 53S280J/883: ROM/PROM, 995-9500-067, 351-1933-012. Substitute compatibility should be verified for your specific system.

What is the NSN for 53S280J/883?

53S280J/883 is cataloged in the U.S. Government catalog under NSN 5962-01-374-5602. This indicates validated use in U.S. government and defense supply chains.

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