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Technical Data Sheet
PartsTable / COMPONENT / 53S1681L883B
53S1681L883B ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND SCHOTTKY AND BIPOLAR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-296-1091, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
53S1681L883B
NSN: 5962-01-296-1091
FSC: 5962
CAGE: 50364 — MMI/AMD (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.280 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND SCHOTTKY AND BIPOLAR
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-296-1091
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 53S1681L883B MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-9 MIL-M-38510
•
TIME RATING PER CHACTERISTIC: 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
•
SPECIFICATION/STANDARD DATA: 81349-MIL-M-38510/210 GOVERNMENT SPECIFICATION
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
INCLOSURE MATERIALCERAMIC
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
CASE OUTLINE SOURCE AND DESIGNATORD-9 MIL-M-38510
TIME RATING PER CHACTERISTIC100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 100.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TERMINAL SURFACE TREATMENTSOLDER
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
SPECIFICATION/STANDARD DATA81349-MIL-M-38510/210 GOVERNMENT SPECIFICATION
MEMORY CAPACITYUNKNOWN
MEMORY DEVICE TYPEROM
VERIFIED SUBSTITUTES & CROSS-REFERENCES 29
6657345-3Interchangeable
interchangeable cross-reference
interchangeable
6657345-7Interchangeable
interchangeable cross-reference
interchangeable
D3636B1Interchangeable
interchangeable cross-reference
interchangeable
M38510/21004BJBInterchangeable
interchangeable cross-reference
interchangeable
M38510/21004BJXInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM HEAD 120Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 53S1681L883B?
53S1681L883B is a MICROCIRCUIT,MEMORY.
What parts can replace 53S1681L883B?
There are 29 known substitutes for 53S1681L883B: 6657345-3, 6657345-7, D3636B1 and 26 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 53S1681L883B?
53S1681L883B is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-296-1091. This indicates validated use in U.S. government and defense supply chains.
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✓ Validated with multiple authoritative sources, including Government, OEM, and Certified sources.
PartsTable Design LLC · partstable.com
Last verified: July 2026