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PartsTable / COMPONENT / 53D410797-21
53D410797-21 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.205 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND ULTRAVIOLET ERASABLE AND HIGH SPEED, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-184-9042, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
53D410797-21
NSN: 5962-01-184-9042
FSC: 5962
CAGE: 76301 — THE BOEING COMPANY DIV DEFENSE (USA)
SPECIFICATIONS
body_width0.600 INCHES MAXIMUM IN
body_height0.205 INCHES MAXIMUM IN
body_length1.290 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND MONOLITHIC AND ULTRAVIOLET ERASABLE AND HIGH SPEED
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePROM
storage_temp_range-55.0 TO 125.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern12 INPUT
end_item_identificationNAVIGATIONAL SET,LORAN AN/ARN-101
inclosure_configurationDUAL-IN-LINE
NSN5962-01-184-9042
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 53D410797-21 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
MAXIMUM POWER DISSIPATION RATING: 720.0 MILLIWATTS
•
FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND ULTRAVIOLET ERASABLE AND HIGH SPEED
•
BODY HEIGHT: 0.205 INCHES MAXIMUM IN
•
OPERATING TEMP RANGE: +0.0 TO 70.0 CELSIUS DEGC
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -0.3 VOLTS MINIMUM POWER SOURCE AND 15.0 VOLTS MAXIMUM POWER SOURCE
•
CURRENT RATING PER CHARACTERISTIC: 8.00 MILLIAMPERES MAXIMUM SUPPLY
•
TIME RATING PER CHACTERISTIC: 2000.00 NANOSECONDS MAXIMUM DELAY NS
•
TERMINAL SURFACE TREATMENT: SOLDER
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
MAXIMUM POWER DISSIPATION RATING720.0 MILLIWATTS
FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND ULTRAVIOLET ERASABLE AND HIGH SPEED
BODY HEIGHT0.205 INCHES MAXIMUM IN
OPERATING TEMP RANGE+0.0 TO 70.0 CELSIUS DEGC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.3 VOLTS MINIMUM POWER SOURCE AND 15.0 VOLTS MAXIMUM POWER SOURCE
CURRENT RATING PER CHARACTERISTIC8.00 MILLIAMPERES MAXIMUM SUPPLY
TIME RATING PER CHACTERISTIC2000.00 NANOSECONDS MAXIMUM DELAY NS
TERMINAL SURFACE TREATMENTSOLDER
MEMORY DEVICE TYPEPROM
CAPITANCE RATING PER CHARACTERISTIC6.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM
VERIFIED SUBSTITUTES & CROSS-REFERENCES 14
86327Interchangeable
interchangeable cross-reference
interchangeable
213Z111U01Interchangeable
interchangeable cross-reference
interchangeable
TMS2716-45JLInterchangeable
interchangeable cross-reference
interchangeable
53D410797-7Interchangeable
interchangeable cross-reference
interchangeable
TMS2716Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 53D410797-21?
53D410797-21 is a MICROCIRCUIT,MEMORY.
What parts can replace 53D410797-21?
There are 14 known substitutes for 53D410797-21: 86327, 213Z111U01, TMS2716-45JL and 11 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 53D410797-21?
53D410797-21 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-184-9042. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026