The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.170 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MAXIMUM IN, overall_diameter: 0.076 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-469-9833, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_length | 0.170 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MAXIMUM IN |
| overall_diameter | 0.076 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 250.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| current_rating_per_characteristic | 35.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 20.0 MAXIMUM BREAKDOWN VOLTAGE, DC |
| maximum_operating_temp_per_measurement_point | 200.0 CELSIUS AMBIENT AIR DEGC |
| NSN | 5961-00-469-9833 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 20.0 MAXIMUM BREAKDOWN VOLTAGE, DC |
| MOUNTING METHOD | TERMINAL |
| OVERALL DIAMETER | 0.076 INCHES MAXIMUM IN |
| MATERIAL | SILICON SEMICONDUCTOR |
| TERMINAL LENGTH | 1.000 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS AMBIENT AIR DEGC |
| POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| OVERALL LENGTH | 0.170 INCHES MAXIMUM IN |
| CURRENT RATING PER CHARACTERISTIC | 35.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |