5356058-001 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

5356058-001: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.250 INCHES MAXIMUM IN, special_features: PROGRAMMED PALC22V10-30WMB, features_provided: MONOLITHIC AND ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-463-3050, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5356058-001

NSN: 5962-01-463-3050
FSC: 5962 — Microcircuits, Electronic
CAGE: 2J622 — SCI TECHNOLOGY, INC (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.250 INCHES MAXIMUM IN
special_features	PROGRAMMED PALC22V10-30WMB
features_provided	MONOLITHIC AND ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
end_item_identification	C-130H ADVANCED LIGHTING CNTROL SYSTEM
NSN	5962-01-463-3050

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PAL

•

CASE OUTLINE SOURCE AND DESIGNATOR: D-9 MIL-M-38510

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PAL
CASE OUTLINE SOURCE AND DESIGNATOR	D-9 MIL-M-38510
BODY LENGTH	1.250 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 5356058-001?

5356058-001 is a MICROCIRCUIT,MEMORY.

What is the NSN for 5356058-001?

5356058-001 is cataloged in the U.S. Government catalog under NSN 5962-01-463-3050. This indicates validated use in U.S. government and defense supply chains.

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5356058-001 — MICROCIRCUIT,MEMORY

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