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Technical Data Sheet
531803-1 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN, body_length: 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN, overall_length: 0.740 INCHES MINIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC, output_logic_form: EMITTER-COUPLED LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-245-5314, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
531803-1
NSN: 5962-00-245-5314
FSC: 5962
CAGE: 96214 — RAYTHEON COMPANY DBA RAYTHEON (USA)
SPECIFICATIONS
body_width0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
body_length0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
overall_length0.740 INCHES MINIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND MONOLITHIC
output_logic_formEMITTER-COUPLED LOGIC
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_patternQUAD 2 INPUT
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
NSN5962-00-245-5314
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN 531803-1 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC
INCLOSURE CONFIGURATION: FLAT PACK
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
TERMINAL SURFACE TREATMENT: SOLDER
INCLOSURE MATERIAL: CERAMIC
TECHNICAL CHARACTERISTICS (FLIS)
BODY WIDTH0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
OVERALL LENGTH0.740 INCHES MINIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND MONOLITHIC
INCLOSURE CONFIGURATIONFLAT PACK
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
BODY HEIGHT0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
TERMINAL SURFACE TREATMENTSOLDER
INCLOSURE MATERIALCERAMIC
INPUT CIRCUIT PATTERNQUAD 2 INPUT
BODY LENGTH0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
VERIFIED SUBSTITUTES & CROSS-REFERENCES 10
2790-1Interchangeable
interchangeable cross-reference
interchangeable
2587067Interchangeable
interchangeable cross-reference
interchangeable
KK190Interchangeable
interchangeable cross-reference
interchangeable
13543Interchangeable
interchangeable cross-reference
interchangeable
SM-A-984701Interchangeable
interchangeable cross-reference
interchangeable
72754-0Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 531803-1?
531803-1 is a MICROCIRCUIT,DIGITAL.
What parts can replace 531803-1?
There are 10 known substitutes for 531803-1: 2790-1, 2587067, KK190 and 7 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 531803-1?
531803-1 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-245-5314. This indicates validated use in U.S. government and defense supply chains.
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