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53154-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · ORING SEAL
PRODUCT OVERVIEW

53154-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.187 INCHES MAXIMUM IN, body_length: 1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC OR GLASS OR METAL, memory_device_type: EPROM. This part is cataloged in the U.S.

Government catalog under NSN 5330-00-342-3469, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
53154-1
NSN: 5330-00-342-3469
NIINs: 003423469, 013767679
FSC: 5330 — Packing and Gasket Materials
CAGE: 63728 — SEALCRAFT CORPORATION (USA)
SPECIFICATIONS
body_width0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.187 INCHES MAXIMUM IN
body_length1.435 INCHES MINIMUM AND 1.485 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND ULTRAVIOLET ERASABLE AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND W/ENABLE AND W/DISABLE AND W/INHIBIT AND MONOLITHIC
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC OR GLASS OR METAL
memory_device_typeEPROM
storage_temp_range-65.0 TO 125.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern17 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5330-00-342-3469
COMPONENT DIAGRAM
O-RING / SEAL — MATERIAL DETERMINES APPLICATION ID: — CROSS-SECTION CS: — SPECIFICATION Material: — Durometer: — Temp: — PN: 53154-1 MFR: OEM ⚠ VERIFY BEFORE ORDERING Wrong material = failure. Viton for oil/fuel, EPDM for water/steam, Buna-N for general purpose, Silicone for food-grade. Chemical incompatibility causes swelling, brittleness, or rapid degradation ✓ BROKER TIP Durometer (hardness) affects sealing pressure tolerance. Higher Shore A = harder = higher pressure. Standard durometer is 70A — verify if application requires different hardness PARTSTABLE TECHNICAL DRAWING — NOT TO SCALE
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is 53154-1?
53154-1 is a MICROCIRCUIT,MEMORY.
What is the NSN for 53154-1?
53154-1 is cataloged in the U.S. Government catalog under NSN 5330-00-342-3469. This indicates validated use in U.S. government and defense supply chains.
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