5309-1J883/B — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

5309-1J883/B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.300 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.975 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-208-0633, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5309-1J883/B

NSN: 5962-01-208-0633
NIINs: 012080633, 012453447, 012736549
FSC: 5962 — Microcircuits, Electronic
CAGE: 50364 — MMI/AMD (USA)

SPECIFICATIONS

body_width	0.300 INCHES MAXIMUM IN
body_height	0.180 INCHES MAXIMUM IN
body_length	0.975 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND SCHOTTKY AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
NSN	5962-01-208-0633

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND W/ENABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.265 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.155 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND W/ENABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.955 INCHES MINIMUM AND 0.990 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

5428457Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

5428414Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

ROM/PROM FAMILY 010Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 5309-1J883/B?

5309-1J883/B is a MICROCIRCUIT,MEMORY.

What parts can replace 5309-1J883/B?

There are 3 known substitutes for 5309-1J883/B: 5428457, 5428414, ROM/PROM FAMILY 010. Substitute compatibility should be verified for your specific system.

What is the NSN for 5309-1J883/B?

5309-1J883/B is cataloged in the U.S. Government catalog under NSN 5962-01-208-0633. This indicates validated use in U.S. government and defense supply chains.

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