5309-1D/883B — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

5309-1D/883B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.300 INCHES MAXIMUM IN, body_height: 0.155 INCHES MAXIMUM IN, body_length: 1.019 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-305-7302, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5309-1D/883B

NSN: 5962-01-305-7302
FSC: 5962 — Microcircuits, Electronic
CAGE: 50364 — MMI/AMD (USA)

SPECIFICATIONS

body_width	0.300 INCHES MAXIMUM IN
body_height	0.155 INCHES MAXIMUM IN
body_length	1.019 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	8 INPUT
end_item_identification	1270-01-142-2855
NSN	5962-01-305-7302

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 8 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.155 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	8 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.155 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND PROGRAMMABLE AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.019 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 3

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

SN92573JReference document

Same NSN cross-reference

Reference document — Secondary reference

DM54S4710/883BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 5309-1D/883B?

5309-1D/883B is a MICROCIRCUIT,MEMORY.

What parts can replace 5309-1D/883B?

There are 3 known substitutes for 5309-1D/883B: ROM/PROM, SN92573J, DM54S4710/883B. Substitute compatibility should be verified for your specific system.

What is the NSN for 5309-1D/883B?

5309-1D/883B is cataloged in the U.S. Government catalog under NSN 5962-01-305-7302. This indicates validated use in U.S. government and defense supply chains.

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