52737 00149: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.095 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN, body_length: 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM SPEED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, precious_material: GOLD. This part is cataloged in the U.S.
Government catalog under NSN 5962-00-001-3011, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| body_height | 0.095 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN |
| body_length | 0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM SPEED |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| precious_material | GOLD |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 3 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | GOLD |
| NSN | 5962-00-001-3011 |
| INPUT CIRCUIT PATTERN | 3 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | GOLD |
| PRECIOUS MATERIAL | GOLD |
| DESIGN FUNCTION AND QUANTITY | 1 INVERTER, DIGITAL |
| BODY WIDTH | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.095 INCHES MINIMUM AND 0.140 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM SPEED |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CASE OUTLINE SOURCE AND DESIGNATOR | N0-001-AD JOINT ELECTRON DEVICE ENGINEERING COUNCIL |