5257-114: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.635 INCHES MAXIMUM IN, mounting_method: UNTHREADED HOLE(S), overall_diameter: 1.200 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE, terminal_type_and_quantity: 1 TAB, SOLDER LUG AND 1 CASE. This part is cataloged in the U.S.
Government catalog under NSN 5961-00-059-5177, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.635 INCHES MAXIMUM IN |
| mounting_method | UNTHREADED HOLE(S) |
| overall_diameter | 1.200 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| mounting_facility_quantity | 2 |
| terminal_type_and_quantity | 1 TAB, SOLDER LUG AND 1 CASE |
| current_rating_per_characteristic | 50.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| voltage_rating_in_volts_per_characteristic | 50.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| maximum_operating_temp_per_measurement_point | 190.0 CELSIUS JUNCTION DEGC |
| NSN | 5961-00-059-5177 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 50.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 190.0 CELSIUS JUNCTION DEGC |
| MOUNTING FACILITY QUANTITY | 2 |
| OVERALL DIAMETER | 1.200 INCHES MAXIMUM IN |
| MOUNTING METHOD | UNTHREADED HOLE(S) |
| OVERALL LENGTH | 0.635 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CURRENT RATING PER CHARACTERISTIC | 50.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| MATERIAL | SILICON SEMICONDUCTOR |
| TERMINAL TYPE AND QUANTITY | 1 TAB, SOLDER LUG AND 1 CASE |