The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include diameter: 0.188 INCHES NOMINAL IN, material: COPPER, construction: SEAMLESS, heat_treatment: ANNEALED, wall_thickness: 0.030 INCHES NOMINAL IN, first_end_style: PLAIN. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-800-3972, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| diameter | 0.188 INCHES NOMINAL IN |
| material | COPPER |
| construction | SEAMLESS |
| heat_treatment | ANNEALED |
| wall_thickness | 0.030 INCHES NOMINAL IN |
| first_end_style | PLAIN |
| features_provided | HERMETICALLY SEALED CASE |
| operating_pressure | 1990.0 POUNDS PER SQUARE INCH (PSI) MAXIMUM LBS |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| cross-sectional_shape_style | PLAIN ROUND |
| measuring_method_and_length | 1200.000 INCHES NOMINAL SPECIFIC IN |
| nondefinitive_spec/std_data | 1N751A TYPE |
| NSN | 5961-00-800-3972 |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| NONDEFINITIVE SPEC/STD DATA | 1N751A TYPE |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| MATERIAL | SILICON SEMICONDUCTOR |