PartsTable
Technical Data Sheet
Download PDF

524439 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · ORING SEAL
PRODUCT OVERVIEW

524439: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include material: RUBBER SILICONE CLASS Q, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, memory_device_type: ROM, center_hole_diameter: 0.253 INCHES MINIMUM AND 0.263 INCHES MAXIMUM IN, cross-sectional_height: 0.067 INCHES MINIMUM AND 0.073 INCHES MAXIMUM IN. This part is cataloged in the U.S.

Government catalog under NSN 5331-00-580-3789, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
524439
NSN: 5331-00-580-3789
NIINs: 005803789, 011748666
FSC: 5331 — O-ring
CAGE: 03104 — TELEDYNE BROWN ENGINEERING, INC. DBA TELEDYNE TURBINE ENGINES DIV TELEDYNE TURBINE ENGINES (USA)
SPECIFICATIONS
materialRUBBER SILICONE CLASS Q
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
memory_device_typeROM
center_hole_diameter0.253 INCHES MINIMUM AND 0.263 INCHES MAXIMUM IN
cross-sectional_height0.067 INCHES MINIMUM AND 0.073 INCHES MAXIMUM IN
NSN5331-00-580-3789
COMPONENT DIAGRAM
O-RING / SEAL — MATERIAL DETERMINES APPLICATION ID: — CROSS-SECTION CS: — SPECIFICATION Material: — Durometer: — Temp: — PN: 524439 MFR: OEM ⚠ VERIFY BEFORE ORDERING Wrong material = failure. Viton for oil/fuel, EPDM for water/steam, Buna-N for general purpose, Silicone for food-grade. Chemical incompatibility causes swelling, brittleness, or rapid degradation ✓ BROKER TIP Durometer (hardness) affects sealing pressure tolerance. Higher Shore A = harder = higher pressure. Standard durometer is 70A — verify if application requires different hardness PARTSTABLE TECHNICAL DRAWING — NOT TO SCALE
KEY FEATURES
•
CROSS-SECTIONAL HEIGHT: 0.067 INCHES MINIMUM AND 0.073 INCHES MAXIMUM IN
•
CENTER HOLE DIAMETER: 0.253 INCHES MINIMUM AND 0.263 INCHES MAXIMUM IN
•
MATERIAL: RUBBER SILICONE CLASS Q
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
CROSS-SECTIONAL HEIGHT0.067 INCHES MINIMUM AND 0.073 INCHES MAXIMUM IN
CENTER HOLE DIAMETER0.253 INCHES MINIMUM AND 0.263 INCHES MAXIMUM IN
MATERIALRUBBER SILICONE CLASS Q
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required
Ready to buy 524439?
Compare prices from verified sellers on eBay
Buy on eBay →
As an eBay Partner, PartsTable may earn a commission. Your price is not affected.
FREQUENTLY ASKED QUESTIONS
What is 524439?
524439 is a MICROCIRCUIT,MEMORY.
What is the NSN for 524439?
524439 is cataloged in the U.S. Government catalog under NSN 5331-00-580-3789. This indicates validated use in U.S. government and defense supply chains.
Community Feedback
Leave a Comment
Comments are reviewed before appearing. You will receive an email to verify before your comment appears.

Request a Quote — 524439