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523826-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

523826-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include inclosure_material: CERAMIC, memory_device_type: PAL, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, end_item_identification: CP-2177/TPX-4, inclosure_configuration: DUAL-IN-LINE, terminal_surface_treatment: SOLDER. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-424-9397, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
523826-1
NSN: 5962-01-424-9397
FSC: 5962 — Microcircuits, Electronic
CAGE: 64694 — TELEPHONICS CORPORATION (USA)
SPECIFICATIONS
inclosure_materialCERAMIC
memory_device_typePAL
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
end_item_identificationCP-2177/TPX-4
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
time_rating_per_chacteristic10.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS NS
part_name_assigned_by_controlling_agencyCMOS, PROGRAMMED ARRAY, 16V8
voltage_rating_and_type_per_characteristic5.0 VOLTS NOMINAL POWER SOURCE
NSN5962-01-424-9397
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 523826-1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: PAL
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 5.0 VOLTS NOMINAL POWER SOURCE
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPAL
VOLTAGE RATING AND TYPE PER CHARACTERISTIC5.0 VOLTS NOMINAL POWER SOURCE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
PART NAME ASSIGNED BY CONTROLLING AGENCYCMOS, PROGRAMMED ARRAY, 16V8
END ITEM IDENTIFICATIONCP-2177/TPX-4
TERMINAL TYPE AND QUANTITY20 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC10.00 NANOSECONDS MAXIMUM INPUT TO OUTPUT ACCESS NS
SUBSTITUTES & CROSS-REFERENCES 2
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8983904RAReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 523826-1?
523826-1 is a MICROCIRCUIT,MEMORY.
What parts can replace 523826-1?
There are 2 known substitutes for 523826-1: ROM/PROM, 5962-8983904RA. Substitute compatibility should be verified for your specific system.
What is the NSN for 523826-1?
523826-1 is cataloged in the U.S. Government catalog under NSN 5962-01-424-9397. This indicates validated use in U.S. government and defense supply chains.
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