51P06709G001 — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

51P06709G001: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.550 INCHES MAXIMUM IN, body_height: 0.150 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS, memory_device_type: ROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-041-3259, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

51P06709G001

NSN: 5962-01-041-3259
FSC: 5962 — Microcircuits, Electronic
CAGE: 94990 — MOTOROLA INC. DBA INTEGRATED INFORMATION SYSTEMS GROUP (USA)

SPECIFICATIONS

body_width	0.550 INCHES MAXIMUM IN
body_height	0.150 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND NEGATIVE OUTPUTS AND W/ENABLE AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-10.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	21 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-041-3259

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 21 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.550 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.150 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND NEGATIVE OUTPUTS AND W/ENABLE AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	21 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.550 INCHES MAXIMUM IN
BODY HEIGHT	0.150 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND NEGATIVE OUTPUTS AND W/ENABLE AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.290 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

DMS 81040BReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

IMP-16A/521DReference document

Same NSN cross-reference

Reference document — Secondary reference

SM28569Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 51P06709G001?

51P06709G001 is a MICROCIRCUIT,DIGITAL.

What parts can replace 51P06709G001?

There are 4 known substitutes for 51P06709G001: DMS 81040B, ROM/PROM, IMP-16A/521D and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 51P06709G001?

51P06709G001 is cataloged in the U.S. Government catalog under NSN 5962-01-041-3259. This indicates validated use in U.S. government and defense supply chains.

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51P06709G001 — MICROCIRCUIT,DIGITAL

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