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PartsTable / COMPONENT / 515C2008-23-020
515C2008-23-020 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.280 INCHES NOMINAL IN, body_height: 0.500 INCHES NOMINAL IN, body_length: 0.785 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-009-8311, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
515C2008-23-020
NSN: 5962-01-009-8311
FSC: 5962
CAGE: 86360 — GE AVIATION SYSTEMS LLC DBA GE AVIATION DIV INFORMATION SYSTEMS - GERMANTOWN (USA)
SPECIFICATIONS
body_width0.280 INCHES NOMINAL IN
body_height0.500 INCHES NOMINAL IN
body_length0.785 INCHES NOMINAL IN
features_providedHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_patternQUAD 2 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-009-8311
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN 515C2008-23-020 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
TERMINAL TYPE AND QUANTITY: 14 PRINTED CIRCUIT
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
INPUT CIRCUIT PATTERN: QUAD 2 INPUT
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.280 INCHES NOMINAL IN
•
TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
•
INCLOSURE MATERIAL: CERAMIC
TECHNICAL CHARACTERISTICS (FLIS)
INCLOSURE CONFIGURATIONDUAL-IN-LINE
TERMINAL TYPE AND QUANTITY14 PRINTED CIRCUIT
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
INPUT CIRCUIT PATTERNQUAD 2 INPUT
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.280 INCHES NOMINAL IN
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
INCLOSURE MATERIALCERAMIC
BODY LENGTH0.785 INCHES NOMINAL IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
VERIFIED SUBSTITUTES & CROSS-REFERENCES 10
537826-1Interchangeable
interchangeable cross-reference
interchangeable
RB5432FInterchangeable
interchangeable cross-reference
interchangeable
503131-1Interchangeable
interchangeable cross-reference
interchangeable
SN5432JInterchangeable
interchangeable cross-reference
interchangeable
DM7432Interchangeable
interchangeable cross-reference
interchangeable
542-215-036Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 515C2008-23-020?
515C2008-23-020 is a MICROCIRCUIT,DIGITAL.
What parts can replace 515C2008-23-020?
There are 10 known substitutes for 515C2008-23-020: 537826-1, RB5432F, 503131-1 and 7 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 515C2008-23-020?
515C2008-23-020 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-009-8311. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026