The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 1.050 INCHES MAXIMUM IN, body_height: 0.250 INCHES MINIMUM AND 0.450 INCHES MAXIMUM IN, body_length: 1.573 INCHES MAXIMUM IN, special_features: CASE CONNECTED TO INPUT TERM., features_provided: HERMETICALLY SEALED AND HYBRID AND POSITIVE OUTPUTS, inclosure_material: GLASS AND METAL. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-455-0842, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 1.050 INCHES MAXIMUM IN |
| body_height | 0.250 INCHES MINIMUM AND 0.450 INCHES MAXIMUM IN |
| body_length | 1.573 INCHES MAXIMUM IN |
| special_features | CASE CONNECTED TO INPUT TERM. |
| features_provided | HERMETICALLY SEALED AND HYBRID AND POSITIVE OUTPUTS |
| inclosure_material | GLASS AND METAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 1 INPUT |
| inclosure_configuration | CAN |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 3 PIN |
| NSN | 5962-00-455-0842 |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 1.050 INCHES MAXIMUM IN |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| CASE OUTLINE SOURCE AND DESIGNATOR | T0-3 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| FEATURES PROVIDED | HERMETICALLY SEALED AND HYBRID AND POSITIVE OUTPUTS |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| INPUT CIRCUIT PATTERN | 1 INPUT |
| INCLOSURE MATERIAL | GLASS AND METAL |
| BODY HEIGHT | 0.250 INCHES MINIMUM AND 0.450 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | CAN |