51127-0003 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

51127-0003: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 13.4 MILLIMETERS NOMINAL MM, body_height: 4.6 MILLIMETERS NOMINAL MM, body_length: 32.0 MILLIMETERS NOMINAL MM, features_provided: LOW POWER AND HIGH SPEED AND STATIC OPERATION, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: PLASTIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-227-2123, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

51127-0003

NSN: 5962-01-227-2123
FSC: 5962 — Microcircuits, Electronic
CAGE: 27914 — HONEYWELL INTERNATIONAL INC DBA HONEYWELL (USA)

SPECIFICATIONS

body_width	13.4 MILLIMETERS NOMINAL MM
body_height	4.6 MILLIMETERS NOMINAL MM
body_length	32.0 MILLIMETERS NOMINAL MM
features_provided	LOW POWER AND HIGH SPEED AND STATIC OPERATION
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
input_circuit_pattern	22 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
maximum_power_dissipation_rating	1.0 WATTS
NSN	5962-01-227-2123

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 22 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 13.4 MILLIMETERS NOMINAL MM

•

BODY HEIGHT: 4.6 MILLIMETERS NOMINAL MM

•

FEATURES PROVIDED: LOW POWER AND HIGH SPEED AND STATIC OPERATION

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: RAM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	22 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	13.4 MILLIMETERS NOMINAL MM
BODY HEIGHT	4.6 MILLIMETERS NOMINAL MM
FEATURES PROVIDED	LOW POWER AND HIGH SPEED AND STATIC OPERATION
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM
BODY LENGTH	32.0 MILLIMETERS NOMINAL MM
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

HM6116P-2Reference document

Same NSN cross-reference

Reference document — Secondary reference

6116LA150DBReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 51127-0003?

51127-0003 is a MICROCIRCUIT,MEMORY.

What parts can replace 51127-0003?

There are 2 known substitutes for 51127-0003: HM6116P-2, 6116LA150DB. Substitute compatibility should be verified for your specific system.

What is the NSN for 51127-0003?

51127-0003 is cataloged in the U.S. Government catalog under NSN 5962-01-227-2123. This indicates validated use in U.S. government and defense supply chains.

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