51096-0231 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

51096-0231: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.600 INCHES MAXIMUM IN, body_height: 0.190 INCHES MAXIMUM IN, body_length: 1.285 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-239-9676, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

51096-0231

NSN: 5962-01-239-9676
FSC: 5962 — Microcircuits, Electronic
CAGE: 27914 — HONEYWELL INTERNATIONAL INC DBA HONEYWELL (USA)

SPECIFICATIONS

body_width	0.600 INCHES MAXIMUM IN
body_height	0.190 INCHES MAXIMUM IN
body_length	1.285 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 125.0 CELSIUS DEGC
operating_temp_range	-10.0 TO 80.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-239-9676

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 12 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.190 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	12 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.190 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.285 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 125.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

51096-0002Reference document

Same NSN cross-reference

Reference document — Secondary reference

TMS2532JLReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

2072710Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 51096-0231?

51096-0231 is a MICROCIRCUIT,MEMORY.

What parts can replace 51096-0231?

There are 4 known substitutes for 51096-0231: 51096-0002, TMS2532JL, ROM/PROM and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 51096-0231?

51096-0231 is cataloged in the U.S. Government catalog under NSN 5962-01-239-9676. This indicates validated use in U.S. government and defense supply chains.

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