51071-0003 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

51071-0003: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.250 INCHES NOMINAL IN, body_height: 0.156 INCHES NOMINAL IN, body_length: 0.937 INCHES NOMINAL IN, bit_quantity: 4096, word_quantity: 512, features_provided: LOW POWER AND 3-STATE OUTPUT AND HERMETICALLY SEALED AND PROGRAMMED. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-113-4271, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

51071-0003

NSN: 5962-01-113-4271
FSC: 5962 — Microcircuits, Electronic
CAGE: 45934 — ONTIC ENGINEERING & MANUFACTURING, INC DBA ONTIC US (USA)

SPECIFICATIONS

body_width	0.250 INCHES NOMINAL IN
body_height	0.156 INCHES NOMINAL IN
body_length	0.937 INCHES NOMINAL IN
bit_quantity	4096
word_quantity	512
features_provided	LOW POWER AND 3-STATE OUTPUT AND HERMETICALLY SEALED AND PROGRAMMED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
NSN	5962-01-113-4271

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 4096

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

WORD QUANTITY: 512

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.250 INCHES NOMINAL IN

•

BODY HEIGHT: 0.156 INCHES NOMINAL IN

•

FEATURES PROVIDED: LOW POWER AND 3-STATE OUTPUT AND HERMETICALLY SEALED AND PROGRAMMED

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	4096
INPUT CIRCUIT PATTERN	10 INPUT
WORD QUANTITY	512
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.250 INCHES NOMINAL IN
BODY HEIGHT	0.156 INCHES NOMINAL IN
FEATURES PROVIDED	LOW POWER AND 3-STATE OUTPUT AND HERMETICALLY SEALED AND PROGRAMMED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

71-3Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 51071-0003?

51071-0003 is a MICROCIRCUIT,MEMORY.

What parts can replace 51071-0003?

There are 2 known substitutes for 51071-0003: 71-3, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for 51071-0003?

51071-0003 is cataloged in the U.S. Government catalog under NSN 5962-01-113-4271. This indicates validated use in U.S. government and defense supply chains.

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