5095750-02-31: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include special_features: ALTERED ITEM DRAWING 82577 H8000689-0XX, features_provided: ELECTROSTATIC SENSITIVE, inclosure_material: SILICON, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, operating_temp_range: +0.0 TO 75.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-458-9082, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| special_features | ALTERED ITEM DRAWING 82577 H8000689-0XX |
| features_provided | ELECTROSTATIC SENSITIVE |
| inclosure_material | SILICON |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | +0.0 TO 75.0 CELSIUS DEGC |
| hybrid_technology_type | MONOLITHIC |
| end_item_identification | B-2 |
| inclosure_configuration | FLAT PACK |
| terminal_type_and_quantity | 20 FLAT LEADS |
| criticality_code_justification | CBBL |
| nuclear_hardness_critical_feature | HARDENED |
| NSN | 5962-01-458-9082 |
| HYBRID TECHNOLOGY TYPE | MONOLITHIC |
| INCLOSURE MATERIAL | SILICON |
| CRITICALITY CODE JUSTIFICATION | CBBL |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE |
| INCLOSURE CONFIGURATION | FLAT PACK |
| MEMORY DEVICE TYPE | PAL |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| SPECIAL FEATURES | ALTERED ITEM DRAWING 82577 H8000689-0XX |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 4.75 VOLTS NOMINAL TOTAL SUPPLY AND 5.25 VOLTS NOMINAL TOTAL SUPPLY |
| OPERATING TEMP RANGE | +0.0 TO 75.0 CELSIUS DEGC |
No substitute or cross-reference records for this part.