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Technical Data Sheet
PartsTable / COMPONENT / 5072470-002
5072470-002 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.240 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-233-2010, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
5072470-002
NSN: 5962-01-233-2010
FSC: 5962
CAGE: K1182 — THALES UK LIMITED DBA THALES UK LTD TRAINING AND SIMULATION (GBR)
SPECIFICATIONS
body_width0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length1.240 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE
output_logic_formN-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-233-2010
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 5072470-002 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
•
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE
•
BODY WIDTH: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
•
TERMINAL TYPE AND QUANTITY: 24 PRINTED CIRCUIT
•
MEMORY DEVICE TYPE: ROM
•
TERMINAL SURFACE TREATMENT: SOLDER
•
TIME RATING PER CHACTERISTIC: 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
BODY HEIGHT0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/ENABLE
BODY WIDTH0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
MEMORY DEVICE TYPEROM
TERMINAL SURFACE TREATMENTSOLDER
TIME RATING PER CHACTERISTIC450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-0.3 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE
INCLOSURE MATERIALCERAMIC
VERIFIED SUBSTITUTES & CROSS-REFERENCES 9
736337Interchangeable
interchangeable cross-reference
interchangeable
8001204JXInterchangeable
interchangeable cross-reference
interchangeable
MD2732AInterchangeable
interchangeable cross-reference
interchangeable
5013823-002Interchangeable
interchangeable cross-reference
interchangeable
ROM/PROMInterchangeable
interchangeable cross-reference
interchangeable
ROM/PROM FAMILY 027Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 5072470-002?
5072470-002 is a MICROCIRCUIT,MEMORY.
What parts can replace 5072470-002?
There are 9 known substitutes for 5072470-002: 736337, 8001204JX, MD2732A and 6 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 5072470-002?
5072470-002 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-233-2010. This indicates validated use in U.S. government and defense supply chains.
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PartsTable Design LLC · partstable.com
Last verified: July 2026