The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: BURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PAL. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-365-0836, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.310 INCHES MAXIMUM IN |
| body_height | 0.185 INCHES MAXIMUM IN |
| body_length | 1.060 INCHES MAXIMUM IN |
| features_provided | BURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 16 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-365-0836 |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
| INCLOSURE MATERIAL | CERAMIC |
| INPUT CIRCUIT PATTERN | 16 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| BODY WIDTH | 0.310 INCHES MAXIMUM IN |
| BODY LENGTH | 1.060 INCHES MAXIMUM IN |
| MEMORY DEVICE TYPE | PAL |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| MAXIMUM POWER DISSIPATION RATING | 300.0 MILLIWATTS |