503236-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

503236-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include bit_quantity: 4096, word_quantity: 512, features_provided: MONOLITHIC AND PROGRAMMABLE AND HERMETICALLY SEALED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS, memory_device_type: ROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-111-9363, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

503236-1

NSN: 5962-01-111-9363
NIINs: 011119363, 011119364
FSC: 5962 — Microcircuits, Electronic
CAGE: 00752 — L3HARRIS TECHNOLOGIES, INC. DBA HARRIS CORP DIV ANTENNA PRODUCTS (USA)

SPECIFICATIONS

bit_quantity	4096
word_quantity	512
features_provided	MONOLITHIC AND PROGRAMMABLE AND HERMETICALLY SEALED
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	8 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
voltage_rating_and_type_per_characteristic	7.0 VOLTS MAXIMUM POWER SOURCE
NSN	5962-01-111-9363

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 4096

•

INPUT CIRCUIT PATTERN: 8 INPUT

•

WORD QUANTITY: 512

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

FEATURES PROVIDED: MONOLITHIC AND PROGRAMMABLE AND HERMETICALLY SEALED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	4096
INPUT CIRCUIT PATTERN	8 INPUT
WORD QUANTITY	512
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
FEATURES PROVIDED	MONOLITHIC AND PROGRAMMABLE AND HERMETICALLY SEALED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE

SUBSTITUTES & CROSS-REFERENCES 2

503251-1Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 026Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is 503236-1?

503236-1 is a MICROCIRCUIT,MEMORY.

What parts can replace 503236-1?

There are 2 known substitutes for 503236-1: 503251-1, ROM/PROM FAMILY 026. Substitute compatibility should be verified for your specific system.

What is the NSN for 503236-1?

503236-1 is cataloged in the U.S. Government catalog under NSN 5962-01-111-9363. This indicates validated use in U.S. government and defense supply chains.

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503236-1 — MICROCIRCUIT,MEMORY

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