503145-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

503145-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 0.840 INCHES MAXIMUM IN, bit_quantity: 1024, word_quantity: 1024, features_provided: BURN IN AND STATIC OPERATION AND 3-STATE OUTPUT. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-127-1978, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

503145-1

NSN: 5962-01-127-1978
NIINs: 011271978, 016076028
FSC: 5962 — Microcircuits, Electronic
CAGE: 00752 — L3HARRIS TECHNOLOGIES, INC. DBA HARRIS CORP DIV ANTENNA PRODUCTS (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	0.840 INCHES MAXIMUM IN
bit_quantity	1024
word_quantity	1024
features_provided	BURN IN AND STATIC OPERATION AND 3-STATE OUTPUT
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	5 INPUT
NSN	5962-01-127-1978

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 1024

•

INPUT CIRCUIT PATTERN: 5 INPUT

•

WORD QUANTITY: 1024

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BURN IN AND STATIC OPERATION AND 3-STATE OUTPUT

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	1024
INPUT CIRCUIT PATTERN	5 INPUT
WORD QUANTITY	1024
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND STATIC OPERATION AND 3-STATE OUTPUT
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	RAM

SUBSTITUTES & CROSS-REFERENCES 2

RB21F02A-2Reference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

N21F02F883Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

Ready to buy 503145-1?

Compare prices from verified sellers on eBay

Buy on eBay →

As an eBay Partner, PartsTable may earn a commission. Your price is not affected.

FREQUENTLY ASKED QUESTIONS

What is 503145-1?

503145-1 is a MICROCIRCUIT,MEMORY.

What parts can replace 503145-1?

There are 2 known substitutes for 503145-1: RB21F02A-2, N21F02F883. Substitute compatibility should be verified for your specific system.

What is the NSN for 503145-1?

503145-1 is cataloged in the U.S. Government catalog under NSN 5962-01-127-1978. This indicates validated use in U.S. government and defense supply chains.

Community Feedback

503145-1 — MICROCIRCUIT,MEMORY

Request a Quote — 503145-1