503130: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: PLASTIC NYLON SEDIMENT BOWL, body_height: 6.350 INCHES NOMINAL IN, body_length: 5.000 INCHES NOMINAL IN, temp_rating: 70.0 FAHRENHEIT NOMINAL DEGF, mounting_type: INLET CONNECTION AND OUTLET CONNECTION SIDE NEAR TOP, overall_length: 0.405 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5961-00-924-4265, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC NYLON SEDIMENT BOWL |
| body_height | 6.350 INCHES NOMINAL IN |
| body_length | 5.000 INCHES NOMINAL IN |
| temp_rating | 70.0 FAHRENHEIT NOMINAL DEGF |
| mounting_type | INLET CONNECTION AND OUTLET CONNECTION SIDE NEAR TOP |
| overall_length | 0.405 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| features_provided | HERMETICALLY SEALED CASE |
| operating_pressure | 150.0 POUNDS PER SQUARE INCH (PSI) MAXIMUM LBS |
| nominal_thread_size | 0.190 INCHES IN |
| end_item_identification | 3825-01-107-2438 |
| thread_series_designator | UNF |
| NSN | 5961-00-924-4265 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 150.0 MAXIMUM REVERSE VOLTAGE, PEAK |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 180.0 CELSIUS JUNCTION DEGC |
| MOUNTING FACILITY QUANTITY | 1 |
| MOUNTING METHOD | THREADED STUD(S) |
| OVERALL LENGTH | 0.405 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL WIDTH ACROSS FLATS | 0.424 INCHES MINIMUM AND 0.437 INCHES MAXIMUM IN |
| NOMINAL THREAD SIZE | 0.190 INCHES IN |
| CURRENT RATING PER CHARACTERISTIC | 15.00 AMPERES MAXIMUM AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE |
| MATERIAL | SILICON SEMICONDUCTOR |