500709-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

500709-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.580 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.210 INCHES MAXIMUM IN, body_length: 1.230 INCHES MAXIMUM IN, features_provided: BURN IN AND HERMETICALLY SEALED AND PROGRAMMABLE, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-122-7630, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

500709-1

NSN: 5962-01-122-7630
FSC: 5962 — Microcircuits, Electronic
CAGE: 21562 — GENERAL DYNAMICS OTS (AEROSPACE), INC. DBA GENERAL DYNAMICS ORDINANCE AND TACTICAL SYSTEMS DIV SEATTLE OPERATIONS (USA)

SPECIFICATIONS

body_width	0.580 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.210 INCHES MAXIMUM IN
body_length	1.230 INCHES MAXIMUM IN
features_provided	BURN IN AND HERMETICALLY SEALED AND PROGRAMMABLE
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 125.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
end_item_identification	F-16 81755
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-122-7630

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.580 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.210 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BURN IN AND HERMETICALLY SEALED AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.580 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.210 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND HERMETICALLY SEALED AND PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.230 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 125.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 2

AM9702AHDLBReference document

Same NSN cross-reference

Reference document — Secondary reference

64-00009-001Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is 500709-1?

500709-1 is a MICROCIRCUIT,MEMORY.

What parts can replace 500709-1?

There are 2 known substitutes for 500709-1: AM9702AHDLB, 64-00009-001. Substitute compatibility should be verified for your specific system.

What is the NSN for 500709-1?

500709-1 is cataloged in the U.S. Government catalog under NSN 5962-01-122-7630. This indicates validated use in U.S. government and defense supply chains.

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500709-1 — MICROCIRCUIT,MEMORY

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