Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 5003785

5003785 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.290 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 0.440 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/STROBE AND W/BUFFERED OUTPUT, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-263-9395, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

5003785

NSN: 5962-01-263-9395
FSC: 5962
CAGE: 54490 — DEPT OF THE ARMY U S ARMY ELECTRONICS COMMAND NIGHT VISION LABORATORY (USA)

SPECIFICATIONS

body_width	0.290 INCHES MAXIMUM IN
body_height	0.120 INCHES MAXIMUM IN
body_length	0.440 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/STROBE AND W/BUFFERED OUTPUT
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	12 INPUT
inclosure_configuration	LEADLESS FLAT PACK
NSN	5962-01-263-9395

COMPONENT DIAGRAM

KEY FEATURES

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL TYPE AND QUANTITY: 18 LEADLESS

•

CASE OUTLINE SOURCE AND DESIGNATOR: C-10 MIL-M-38510

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VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -1.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE

•

TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

MEMORY DEVICE TYPE: RAM

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TERMINAL SURFACE TREATMENT: SOLDER

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TIME RATING PER CHACTERISTIC: 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL TYPE AND QUANTITY	18 LEADLESS
CASE OUTLINE SOURCE AND DESIGNATOR	C-10 MIL-M-38510
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	-1.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY DEVICE TYPE	RAM
TERMINAL SURFACE TREATMENT	SOLDER
TIME RATING PER CHACTERISTIC	150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
INCLOSURE CONFIGURATION	LEADLESS FLAT PACK
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND W/STROBE AND W/BUFFERED OUTPUT

VERIFIED SUBSTITUTES & CROSS-REFERENCES 23

82010Interchangeable