5003739: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.350 INCHES NOMINAL IN, body_height: 0.080 INCHES MAXIMUM IN, body_length: 0.350 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-251-8927, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.350 INCHES NOMINAL IN |
| body_height | 0.080 INCHES MAXIMUM IN |
| body_length | 0.350 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND SCHOTTKY |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-251-8927 |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 8 BUFFER |
| BODY WIDTH | 0.350 INCHES NOMINAL IN |
| BODY HEIGHT | 0.080 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND SCHOTTKY |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| BODY LENGTH | 0.350 INCHES NOMINAL IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |