495.373 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

495.373: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include material: TITANIUM, body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 1.280 INCHES MAXIMUM IN, overall_width: 22.0 MILLIMETERS NOMINAL MM, overall_height: 32.0 MILLIMETERS NOMINAL MM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-298-6801, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

495.373

NSN: 5962-01-298-6801
NIINs: 012986801, 015143630
FSC: 5962 — Microcircuits, Electronic
CAGE: 05869 — RAYTHEON COMPANY DIV RMD STRATEGIC (USA)

SPECIFICATIONS

material	TITANIUM
body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length	1.280 INCHES MAXIMUM IN
overall_width	22.0 MILLIMETERS NOMINAL MM
overall_height	32.0 MILLIMETERS NOMINAL MM
overall_length	17.0 MILLIMETERS NOMINAL MM
memory_capacity	UNKNOWN
special_features	OBLONG SHAPE SYNTHES MESH
features_provided	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
NSN	5962-01-298-6801

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND BIPOLAR
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
CASE OUTLINE SOURCE AND DESIGNATOR	D-9 MIL-M-38510
BODY LENGTH	1.280 INCHES MAXIMUM IN

SUBSTITUTES & CROSS-REFERENCES 3

722974-50Reference document

Same NSN cross-reference

Reference document — Secondary reference

5962-8552702LAReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 116Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is 495.373?

495.373 is a MICROCIRCUIT,MEMORY.

What parts can replace 495.373?

There are 3 known substitutes for 495.373: 722974-50, 5962-8552702LA, ROM/PROM FAMILY 116. Substitute compatibility should be verified for your specific system.

What is the NSN for 495.373?

495.373 is cataloged in the U.S. Government catalog under NSN 5962-01-298-6801. This indicates validated use in U.S. government and defense supply chains.

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