The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.170 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.000 INCHES MINIMUM IN, overall_diameter: 0.076 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-419-2898, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.170 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.000 INCHES MINIMUM IN |
| overall_diameter | 0.076 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 125.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| current_rating_per_characteristic | 300.00 MILLIAMPERES MAXIMUM REVERSE CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 1.0 MAXIMUM FORWARD VOLTAGE, PEAK |
| maximum_operating_temp_per_measurement_point | 125.0 CELSIUS AMBIENT AIR DEGC |
| NSN | 5961-00-419-2898 |
| OVERALL DIAMETER | 0.076 INCHES MAXIMUM IN |
| POWER RATING PER CHARACTERISTIC | 125.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| MATERIAL | SILICON SEMICONDUCTOR |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 1.0 MAXIMUM FORWARD VOLTAGE, PEAK |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL LENGTH | 0.170 INCHES MAXIMUM IN |
| TERMINAL LENGTH | 1.000 INCHES MINIMUM IN |
| MOUNTING METHOD | TERMINAL |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 CELSIUS AMBIENT AIR DEGC |
| CURRENT RATING PER CHARACTERISTIC | 300.00 MILLIAMPERES MAXIMUM REVERSE CURRENT, DC |