477-2264-001 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

477-2264-001: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.250 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, precious_material: GOLD. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-261-2290, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

477-2264-001

NSN: 5962-01-261-2290
FSC: 5962 — Microcircuits, Electronic
CAGE: 94756 — THE BOEING COMPANY DIV LEGACY BOEING HB1 (USA)

SPECIFICATIONS

body_width	0.310 INCHES MAXIMUM IN
body_height	0.185 INCHES MAXIMUM IN
body_length	1.250 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
precious_material	GOLD
inclosure_material	METAL OR CERAMIC OR PLASTIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
NSN	5962-01-261-2290

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: METAL OR CERAMIC OR PLASTIC

•

TERMINAL SURFACE TREATMENT: GOLD

•

PRECIOUS MATERIAL: GOLD

•

BODY WIDTH: 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.185 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	METAL OR CERAMIC OR PLASTIC
TERMINAL SURFACE TREATMENT	GOLD
PRECIOUS MATERIAL	GOLD
BODY WIDTH	0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.185 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND BIPOLAR AND PROGRAMMABLE
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
CASE OUTLINE SOURCE AND DESIGNATOR	D-9 MIL-M-38510

SUBSTITUTES & CROSS-REFERENCES 7

AM27S45/BLAReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

5962-85527Reference document

Same NSN cross-reference

Reference document — Identification reference

5962-8552701LASame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

AM27S45/DMCReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

5962-8552701LXReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusCancelled· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is 477-2264-001?

477-2264-001 is a MICROCIRCUIT,MEMORY.

What parts can replace 477-2264-001?

There are 7 known substitutes for 477-2264-001: AM27S45/BLA, ROM/PROM, 5962-85527 and 4 more. Substitute compatibility should be verified for your specific system.

What is the NSN for 477-2264-001?

477-2264-001 is cataloged in the U.S. Government catalog under NSN 5962-01-261-2290. This indicates validated use in U.S. government and defense supply chains.

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477-2264-001 — MICROCIRCUIT,MEMORY

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