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Technical Data Sheet
PartsTable / COMPONENT / 477-0827-002
477-0827-002 ✓ Verified by PartsTable
— · COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.302 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND PROGRAMMABLE AND W/OPEN COLLECTOR, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-026-7928, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
477-0827-002
NSN: 5962-01-026-7928
FSC: 5962
CAGE: 94756 — THE BOEING COMPANY DIV LEGACY BOEING HB1 (USA)
SPECIFICATIONS
body_width0.302 INCHES MAXIMUM IN
body_height0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
body_length0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
memory_capacityUNKNOWN
features_providedHERMETICALLY SEALED AND PROGRAMMABLE AND W/OPEN COLLECTOR
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range+0.0 TO 75.0 CELSIUS DEGC
input_circuit_pattern6 INPUT
inclosure_configurationDUAL-IN-LINE
NSN5962-01-026-7928
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 477-0827-002 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
FEATURES PROVIDED: HERMETICALLY SEALED AND PROGRAMMABLE AND W/OPEN COLLECTOR
•
MEMORY CAPACITY: UNKNOWN
•
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
•
MEMORY DEVICE TYPE: ROM
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: -1.2 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
•
TERMINAL SURFACE TREATMENT: SOLDER
•
TIME RATING PER CHACTERISTIC: 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
•
OPERATING TEMP RANGE: +0.0 TO 75.0 CELSIUS DEGC
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS (FLIS)
FEATURES PROVIDEDHERMETICALLY SEALED AND PROGRAMMABLE AND W/OPEN COLLECTOR
MEMORY CAPACITYUNKNOWN
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
MEMORY DEVICE TYPEROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC-1.2 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
TERMINAL SURFACE TREATMENTSOLDER
TIME RATING PER CHACTERISTIC50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
OPERATING TEMP RANGE+0.0 TO 75.0 CELSIUS DEGC
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
INCLOSURE MATERIALCERAMIC AND GLASS
VERIFIED SUBSTITUTES & CROSS-REFERENCES 13
B0818001-001Interchangeable
interchangeable cross-reference
interchangeable
DH83-2469-1Interchangeable
interchangeable cross-reference
interchangeable
82-23Interchangeable
interchangeable cross-reference
interchangeable
C6DZ-8620-BInterchangeable
interchangeable cross-reference
interchangeable
41327Interchangeable
interchangeable cross-reference
interchangeable
1122-880Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is 477-0827-002?
477-0827-002 is a MICROCIRCUIT,MEMORY.
What parts can replace 477-0827-002?
There are 13 known substitutes for 477-0827-002: B0818001-001, DH83-2469-1, 82-23 and 10 more. Substitute compatibility should be verified for your specific system.
What is the NSN for 477-0827-002?
477-0827-002 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-026-7928. This indicates validated use in U.S. government and defense supply chains.
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Last verified: July 2026