The MICROCIRCUIT,LINEAR is a the manufacturer industrial component. Key specifications include body_width: 0.155 INCHES NOMINAL IN, body_height: 0.059 INCHES NOMINAL IN, body_length: 0.255 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED, inclosure_material: CERAMIC, operating_temp_range: -55.0 TO 100.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-008-2564, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.155 INCHES NOMINAL IN |
| body_height | 0.059 INCHES NOMINAL IN |
| body_length | 0.255 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED |
| inclosure_material | CERAMIC |
| operating_temp_range | -55.0 TO 100.0 CELSIUS DEGC |
| input_circuit_pattern | 2 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER OR TIN |
| design_function_and_quantity | 1 AMPLIFIER, DIFFERENTIAL |
| NSN | 5962-01-008-2564 |
| INPUT CIRCUIT PATTERN | 2 INPUT |
| TERMINAL SURFACE TREATMENT | SOLDER OR TIN |
| OPERATING TEMP RANGE | -55.0 TO 100.0 CELSIUS DEGC |
| INCLOSURE MATERIAL | CERAMIC |
| FEATURES PROVIDED | HERMETICALLY SEALED |
| DESIGN FUNCTION AND QUANTITY | 1 AMPLIFIER, DIFFERENTIAL |
| INCLOSURE CONFIGURATION | FLAT PACK |
| BODY WIDTH | 0.155 INCHES NOMINAL IN |
| BODY HEIGHT | 0.059 INCHES NOMINAL IN |
| BODY LENGTH | 0.255 INCHES NOMINAL IN |