460870: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.358 INCHES NOMINAL IN, body_height: 0.100 INCHES NOMINAL IN, body_length: 0.358 INCHES NOMINAL IN, features_provided: BIPOLAR AND SCHOTTKY AND 3-STATE OUTPUT AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 6670-00-972-1428, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.358 INCHES NOMINAL IN |
| body_height | 0.100 INCHES NOMINAL IN |
| body_length | 0.358 INCHES NOMINAL IN |
| special_features | SHALL MEET REQUIREMENTS OF MIL-M-38510/34105B2X; AND DEVICE SHALL BE CAPABLE OF MEETING AN ESD LEVEL OF A CLASS 2 MINIMUM |
| features_provided | BIPOLAR AND SCHOTTKY AND 3-STATE OUTPUT AND MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| end_item_identification | UNIVERSAL EXCITER UPGRADE |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 6670-00-972-1428 |