The PLATE,WALL,ELECTRICAL is a the manufacturer industrial component. Key specifications include material: COPPER ALLOY OVERALL, swage_depth: 0.062 INCHES IN, overall_height: 0.391 INCHES IN, terminal_length: 0.196 INCHES IN, largest_diameter: 0.093 INCHES SINGLE END IN, overall_diameter: 0.125 INCHES IN. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5940-00-082-4973, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | COPPER ALLOY OVERALL |
| swage_depth | 0.062 INCHES IN |
| overall_height | 0.391 INCHES IN |
| terminal_length | 0.196 INCHES IN |
| largest_diameter | 0.093 INCHES SINGLE END IN |
| overall_diameter | 0.125 INCHES IN |
| special_features | 0.094 IN. MOUNTING HOLE DIA IN |
| basic_shape_style | NONTUBULAR, ROUND |
| surface_treatment | SOLDER OR TIN OVERALL SECOND LAYER |
| minor_bushing_length | 0.172 INCHES IN |
| mounting_method_style | SWAGE |
| turret_minor_diameter | 0.046 INCHES SINGLE END IN |
| NSN | 5940-00-082-4973 |
| SWAGE DEPTH | 0.062 INCHES IN |
| CONDUCTOR ACCOMMODATION TYPE | DOUBLE TURRET SINGLE END |
| MATERIAL | COPPER ALLOY OVERALL |
| MINOR BUSHING LENGTH | 0.172 INCHES IN |
| BASIC SHAPE STYLE | NONTUBULAR, ROUND |
| SURFACE TREATMENT | SOLDER OR TIN OVERALL SECOND LAYER |
| ELECTRICAL INSULATION FEATURE | UNINSULATED |
| SWAGE OUTSIDE DIAMETER | 0.090 INCHES IN |
| SURFACE TREATMENT | COPPER OVERALL FIRST LAYER |
| SPECIAL FEATURES | 0.094 IN. MOUNTING HOLE DIA IN |