IBM 8GB (2x4GB) DDR2 Main Storage. Key specifications include head_style: FLAT, stem_style: GROOVED, head_height: 0.1560 INCHES MINIMUM AND 0.1710 INCHES MAXIMUM IN, neck_radius: 0.2500 INCHES NOMINAL IN, stem_length: 3.7795 INCHES MINIMUM AND 3.8045 INCHES MAXIMUM IN, groove_width: 0.0950 INCHES MINIMUM AND 0.1050 INCHES MAXIMUM IN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5998-00-968-5513, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| head_style | FLAT |
| stem_style | GROOVED |
| head_height | 0.1560 INCHES MINIMUM AND 0.1710 INCHES MAXIMUM IN |
| neck_radius | 0.2500 INCHES NOMINAL IN |
| stem_length | 3.7795 INCHES MINIMUM AND 3.8045 INCHES MAXIMUM IN |
| groove_width | 0.0950 INCHES MINIMUM AND 0.1050 INCHES MAXIMUM IN |
| stem_diameter | 0.3080 INCHES MINIMUM AND 0.3090 INCHES MAXIMUM IN |
| chamfer_length | 0.0312 INCHES NOMINAL IN |
| groove_diameter | 0.2670 INCHES MINIMUM AND 0.2730 INCHES MAXIMUM IN |
| outside_diameter | 1.1200 INCHES MINIMUM AND 1.1300 INCHES MAXIMUM IN |
| seat_angle_in_deg | 45.0 |
| carbon_relief_groove | NOT INCLUDED |
| NSN | 5998-00-968-5513 |
| SPECIAL FEATURES | CAPACITOR 9; PRINTED WIRING BOARD 1; RESISTOR 24; SEMICONDUCTOR DEVICE,DIODE 6; TRANSISTOR 6 |
| OVERALL WIDTH | 2.688 INCHES NOMINAL IN |
| OVERALL HEIGHT | 0.575 INCHES NOMINAL IN |
| OVERALL LENGTH | 3.750 INCHES NOMINAL IN |
| SPECIAL FEATURES | CAPACITOR 9; PRINTED WIRING BOARD 1; RESISTOR 24; SEMICONDUCTOR DEVICE,DIODE 6; TRANSISTOR 6 |
| OVERALL WIDTH | 2.688 INCHES NOMINAL IN |
| OVERALL HEIGHT | 0.575 INCHES NOMINAL IN |
| OVERALL LENGTH | 3.750 INCHES NOMINAL IN |