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44256-1 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

44256-1: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.285 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN, body_length: 0.880 INCHES MINIMUM AND 0.900 INCHES MAXIMUM IN, features_provided: 3-STATE OUTPUT AND SCHOTTKY AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-247-8342, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
44256-1
NSN: 5962-01-247-8342
NIINs: 012478342, 014955005
FSC: 5962 — Microcircuits, Electronic
CAGE: 05869 — RAYTHEON COMPANY DIV RMD STRATEGIC (USA)
SPECIFICATIONS
body_width0.285 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height0.145 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN
body_length0.880 INCHES MINIMUM AND 0.900 INCHES MAXIMUM IN
features_provided3-STATE OUTPUT AND SCHOTTKY AND PROGRAMMED
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern12 INPUT
end_item_identification34B AND 44B BRAKE ASSEMBLIES
inclosure_configurationDUAL-IN-LINE
NSN5962-01-247-8342
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 44256-1 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 12 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.285 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.145 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN
•
FEATURES PROVIDED: 3-STATE OUTPUT AND SCHOTTKY AND PROGRAMMED
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN12 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.285 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT0.145 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN
FEATURES PROVIDED3-STATE OUTPUT AND SCHOTTKY AND PROGRAMMED
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
BODY LENGTH0.880 INCHES MINIMUM AND 0.900 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 2
ROM/PROM FAMILY 030Reference document
Same NSN cross-reference
Reference document — Secondary reference
722919-50Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is 44256-1?
44256-1 is a MICROCIRCUIT,MEMORY.
What parts can replace 44256-1?
There are 2 known substitutes for 44256-1: ROM/PROM FAMILY 030, 722919-50. Substitute compatibility should be verified for your specific system.
What is the NSN for 44256-1?
44256-1 is cataloged in the U.S. Government catalog under NSN 5962-01-247-8342. This indicates validated use in U.S. government and defense supply chains.
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