The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 1.270 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 1.270 INCHES MAXIMUM IN, features_provided: HYBRID AND HERMETICALLY SEALED AND BURN IN, MIL-STD-883, CLASS B, inclosure_material: CERAMIC, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-179-8088, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 1.270 INCHES MAXIMUM IN |
| body_height | 0.180 INCHES MAXIMUM IN |
| body_length | 1.270 INCHES MAXIMUM IN |
| features_provided | HYBRID AND HERMETICALLY SEALED AND BURN IN, MIL-STD-883, CLASS B |
| inclosure_material | CERAMIC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| design_function_and_quantity | 1 TRANSCEIVER |
| NSN | 5962-01-179-8088 |
| DESIGN FUNCTION AND QUANTITY | 1 TRANSCEIVER |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| FEATURES PROVIDED | HYBRID AND HERMETICALLY SEALED AND BURN IN, MIL-STD-883, CLASS B |
| BODY HEIGHT | 0.180 INCHES MAXIMUM IN |
| INCLOSURE MATERIAL | CERAMIC |
| BODY WIDTH | 1.270 INCHES MAXIMUM IN |
| BODY LENGTH | 1.270 INCHES MAXIMUM IN |