The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: COPPER ALLOY 230, thickness: 0.375 INCHES NOMINAL IN, bore_diameter: 0.2500 INCHES MINIMUM AND 0.2520 INCHES MAXIMUM IN, outside_diameter: 0.437 INCHES NOMINAL IN, style_designator: PLAIN ROUND, surface_treatment: NICKEL. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 3040-00-529-1136, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | COPPER ALLOY 230 |
| thickness | 0.375 INCHES NOMINAL IN |
| bore_diameter | 0.2500 INCHES MINIMUM AND 0.2520 INCHES MAXIMUM IN |
| outside_diameter | 0.437 INCHES NOMINAL IN |
| style_designator | PLAIN ROUND |
| surface_treatment | NICKEL |
| nominal_thread_size | 0.112 INCHES THREAD IN |
| securing_hole_quantity | 2 |
| hole_diameter_and_location | 0.0625 INCHES NOMINAL 1ST HOLE IN |
| securing_hole_type_and_location | UNTHREADED 1ST HOLE AND THREADED 2ND HOLE |
| material_document_and_classification | QQ-B-626, ALLOY 230, 1/2H FED SPEC SINGLE MATERIAL RESPONSE |
| screw_thread_series_designator_and_location | 2ND HOLE UNIFIED NATIONAL COARSE (UNC) |
| NSN | 3040-00-529-1136 |
| SCREW THREAD SERIES DESIGNATOR AND LOCATION | 2ND HOLE UNIFIED NATIONAL COARSE (UNC) |
| ANGLE BETWEEN CENTERLINES OF SECURING HOLES IN DEG | 90.0 |
| MATERIAL DOCUMENT AND CLASSIFICATION | QQ-B-626, ALLOY 230, 1/2H FED SPEC SINGLE MATERIAL RESPONSE |
| SURFACE TREATMENT | NICKEL |
| STYLE DESIGNATOR | PLAIN ROUND |
| MATERIAL | COPPER ALLOY 230 |
| HOLE DIAMETER AND LOCATION | 0.0625 INCHES NOMINAL 1ST HOLE IN |
| SECURING HOLE TYPE AND LOCATION | UNTHREADED 1ST HOLE AND THREADED 2ND HOLE |
| NOMINAL THREAD SIZE | 0.112 INCHES THREAD IN |
| BORE DIAMETER | 0.2500 INCHES MINIMUM AND 0.2520 INCHES MAXIMUM IN |