The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.610 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 1.200 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND PROGRAMMED AND BIPOLAR AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-190-8283, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.610 INCHES MAXIMUM IN |
| body_height | 0.180 INCHES MAXIMUM IN |
| body_length | 1.200 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND PROGRAMMED AND BIPOLAR AND SCHOTTKY |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PROM |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 14 INPUT |
| end_item_identification | AN/ALQ-161, B-1B |
| inclosure_configuration | DUAL-IN-LINE |
| NSN | 5962-01-190-8283 |
| END ITEM IDENTIFICATION | AN/ALQ-161, B-1B |
| MEMORY DEVICE TYPE | PROM |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY LENGTH | 1.230 INCHES MINIMUM AND 1.285 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.220 INCHES MAXIMUM IN |
| BODY WIDTH | 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| FEATURES PROVIDED | MONOLITHIC AND SELECTED ITEM AND BIPOLAR AND SCHOTTKY AND 3-STATE OUTPUT AND PROGRAMMED |