Name: MICROCIRCUIT,MEMORY
Brand: Unknown
SKU: 435209-1

435209-1 ✓ Verified by PartsTable

— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.120 INCHES MAXIMUM IN, body_length: 1.380 INCHES MINIMUM AND 1.430 INCHES MAXIMUM IN, memory_capacity: UNKNOWN, features_provided: HERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC AND BURN IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-226-2279, indicating validated use in U.S.

government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

435209-1

NSN: 5962-01-226-2279
FSC: 5962
CAGE: 00752 — L3HARRIS TECHNOLOGIES, INC. DBA HARRIS CORP DIV ANTENNA PRODUCTS (USA)

SPECIFICATIONS

body_width	0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.120 INCHES MAXIMUM IN
body_length	1.380 INCHES MINIMUM AND 1.430 INCHES MAXIMUM IN
memory_capacity	UNKNOWN
features_provided	HERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC AND BURN IN
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	RAM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	17 INPUT
NSN	5962-01-226-2279

COMPONENT DIAGRAM

KEY FEATURES

•

FEATURES PROVIDED: HERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC AND BURN IN

•

BODY WIDTH: 0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.120 INCHES MAXIMUM IN

•

MEMORY DEVICE TYPE: RAM

•

TERMINAL SURFACE TREATMENT: SOLDER

•

TERMINAL TYPE AND QUANTITY: 28 PRINTED CIRCUIT

•

TIME RATING PER CHACTERISTIC: 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS

•

VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 7.0 VOLTS MAXIMUM POWER SOURCE

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

FEATURES PROVIDED	HERMETICALLY SEALED AND W/ENABLE AND MONOLITHIC AND BURN IN
BODY WIDTH	0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.120 INCHES MAXIMUM IN
MEMORY DEVICE TYPE	RAM
TERMINAL SURFACE TREATMENT	SOLDER
TERMINAL TYPE AND QUANTITY	28 PRINTED CIRCUIT
TIME RATING PER CHACTERISTIC	80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT NS
VOLTAGE RATING AND TYPE PER CHARACTERISTIC	7.0 VOLTS MAXIMUM POWER SOURCE
TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
MEMORY CAPACITY	UNKNOWN

VERIFIED SUBSTITUTES & CROSS-REFERENCES 24

759856Interchangeable