The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES NOMINAL IN, body_height: 0.330 INCHES NOMINAL IN, body_length: 1.250 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-299-6859, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.500 INCHES NOMINAL IN |
| body_height | 0.330 INCHES NOMINAL IN |
| body_length | 1.250 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| end_item_identification | EA-6B ACFT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-299-6859 |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INCLOSURE MATERIAL | CERAMIC |
| BODY HEIGHT | 0.330 INCHES NOMINAL IN |
| TERMINAL SURFACE TREATMENT | SOLDER |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| BODY LENGTH | 1.250 INCHES NOMINAL IN |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| BODY WIDTH | 0.500 INCHES NOMINAL IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED |