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41221-122-00-9 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

41221-122-00-9: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: BIPOLAR AND BURN IN, MIL-STD-883, CLASS B AND PROGRAMMABLE AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: ROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: LEADED CHIP CARRIER. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-344-9749, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
41221-122-00-9
NSN: 5962-01-344-9749
FSC: 5962 — Microcircuits, Electronic
CAGE: K4556 — BRITISH AEROSPACE DEFENCE SYSTEMS LTD T/A BAE SYSTEMS (GBR)
SPECIFICATIONS
features_providedBIPOLAR AND BURN IN, MIL-STD-883, CLASS B AND PROGRAMMABLE AND SCHOTTKY
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeROM
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationLEADED CHIP CARRIER
terminal_type_and_quantity32 PIN
NSN5962-01-344-9749
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN 41221-122-00-9 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
FEATURES PROVIDED: BIPOLAR AND BURN IN, MIL-STD-883, CLASS B AND PROGRAMMABLE AND SCHOTTKY
•
INCLOSURE CONFIGURATION: LEADED CHIP CARRIER
•
MEMORY DEVICE TYPE: ROM
•
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 32 PIN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
FEATURES PROVIDEDBIPOLAR AND BURN IN, MIL-STD-883, CLASS B AND PROGRAMMABLE AND SCHOTTKY
INCLOSURE CONFIGURATIONLEADED CHIP CARRIER
MEMORY DEVICE TYPEROM
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY32 PIN
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES

No substitute or cross-reference records for this part.

LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is 41221-122-00-9?
41221-122-00-9 is a MICROCIRCUIT,MEMORY.
What is the NSN for 41221-122-00-9?
41221-122-00-9 is cataloged in the U.S. Government catalog under NSN 5962-01-344-9749. This indicates validated use in U.S. government and defense supply chains.
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